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A Guide to Lead-free Solders
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A Guide to Lead-free Solders - libro nuevo

2002, ISBN: 9781849965774

The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2… Más…

Nr. 978-1-84996-577-4. Gastos de envío:Worldwide free shipping, , plus shipping costs. (EUR 0.00)
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A Guide to Lead-free Solders: Physical Metallurgy and Reliability - Evans, John W.
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A Guide to Lead-free Solders: Physical Metallurgy and Reliability - Pasta blanda

2010, ISBN: 9781849965774

Editor: Engelmaier, Werner, Contributor: Kwon, Dong-il, Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2007, 220 Seiten, Publiziert: 2010-10-13T00:00:01Z, Produktgru… Más…

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A Guide to Lead-free Solders - Evans, John W.
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Evans, John W.:
A Guide to Lead-free Solders - Pasta blanda

2010

ISBN: 9781849965774

[ED: Softcover], [PU: Springer / Springer London / Springer, Berlin], The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. E… Más…

Gastos de envío:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) buecher.de GmbH & Co. KG
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A Guide to Lead-free Solders: Physical Metallurgy and Reliability - Evans, John W.
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Evans, John W.:
A Guide to Lead-free Solders: Physical Metallurgy and Reliability - Pasta blanda

2010, ISBN: 9781849965774

Editor: Engelmaier, Werner, Contributor: Kwon, Dong-il, Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2007, 220 Seiten, Publiziert: 2010-10-18T00:00:01Z, Produktgru… Más…

Gebraucht, wie neu. Gastos de envío:Usually ships within 13 to 14 days. Real shipping costs can differ from the ones shown here. (EUR 3.60) tabletopart
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A Guide to Lead-free Solders - John W. Evans
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John W. Evans:
A Guide to Lead-free Solders - Pasta blanda

2007, ISBN: 9781849965774

*A Guide to Lead-free Solders* - Physical Metallurgy and Reliability. Softcover reprint of hardcover 1st ed. 2007 / Taschenbuch für 133.49 € / Aus dem Bereich: Bücher, Wissenschaft, Techn… Más…

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Detalles del libro
A Guide to Lead-free Solders

The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.

Detalles del libro - A Guide to Lead-free Solders


EAN (ISBN-13): 9781849965774
ISBN (ISBN-10): 1849965773
Tapa dura
Tapa blanda
Año de publicación: 2010
Editorial: Springer London
220 Páginas
Peso: 0,339 kg
Idioma: eng/Englisch

Libro en la base de datos desde 2011-05-18T04:37:04-05:00 (Mexico City)
Página de detalles modificada por última vez el 2023-12-27T11:40:03-06:00 (Mexico City)
ISBN/EAN: 9781849965774

ISBN - escritura alterna:
1-84996-577-3, 978-1-84996-577-4
Mode alterno de escritura y términos de búsqueda relacionados:
Autor del libro: john evans, eva engel, werner eva
Título del libro: physical metallurgy, lead


Datos del la editorial

Autor: John W. Evans
Título: A Guide to Lead-free Solders - Physical Metallurgy and Reliability
Editorial: Springer; Springer London
206 Páginas
Año de publicación: 2010-10-13
London; GB
Impreso en
Idioma: Inglés
133,70 € (DE)
137,45 € (AT)
179,85 CHF (CH)
POD
XIV, 206 p. 114 illus.

BC; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; Lead Substitutes; Metall; Solder Alloys; Standard; architecture; cutting; design; electronics; manufacturing; materials; metal; metallurgy; microstructure; production; reliability; quality control, reliability, safety and risk; Electronics and Microelectronics, Instrumentation; Metals and Alloys; Optical Materials; Security Science and Technology; Mechanical Engineering; Machines, Tools, Processes; Materialwissenschaft; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; Sicherheitssysteme und Brandmeldeanlagen; Maschinenbau; Fertigungstechnik und Ingenieurwesen; BB

to Solder Alloys and Their Properties.- Packaging Architecture and Assembly Technology.- Wetting and Joint Formation.- Microstructural Instability in Solders.- Intermetallic Formation and Growth.- Mechanical Properties and Creep Behavior.- Thermomechanical Fatigue.- Product Assurance.
Covers all aspects of lead-free solders from physical properties to product assurance The reader will be able to choose new solders more suitable to the climate of legislation and public opinion based on a comparison of their strengths and weaknesses and with the properties of the lead-based solders currently in use The theoretical basis of the book will allow solder producers to make solders with more desirable properties in the future Includes supplementary material: sn.pub/extras

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