ISBN: 9780470065419
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2007, ISBN: 9780470065419
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ISBN: 9780470065419
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in… Más…
2007, ISBN: 9780470065419
The topic of thin films is an area of increasing importance inmaterials science, electrical engineering and applied solid statephysics; with both research and industrial applications inmi… Más…
2007
ISBN: 9780470065419
eBooks, eBook Download (PDF), 1. Auflage, [PU: John Wiley & Sons], John Wiley & Sons, 2007
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Detalles del libro - Dielectric Films for Advanced Microelectronics
EAN (ISBN-13): 9780470065419
ISBN (ISBN-10): 0470065419
Año de publicación: 2007
Editorial: Wiley
508 Páginas
Idioma: eng/Englisch
Libro en la base de datos desde 2009-11-27T05:40:01-06:00 (Mexico City)
Página de detalles modificada por última vez el 2023-11-06T11:24:21-06:00 (Mexico City)
ISBN/EAN: 9780470065419
ISBN - escritura alterna:
0-470-06541-9, 978-0-470-06541-9
Mode alterno de escritura y términos de búsqueda relacionados:
Autor del libro: martin green, marti green, green karen, john paul, martin mae, baklanov
Título del libro: microelectronics
Datos del la editorial
Autor: Mikhail Baklanov
Título: Wiley Series in Materials for Electronic & Optoelectronic Applications; Dielectric Films for Advanced Microelectronics
Editorial: Wiley; John Wiley & Sons
508 Páginas
Año de publicación: 2007-04-04
Idioma: Inglés
208,99 € (DE)
EA; E107; E-Book; Nonbooks, PBS / Chemie; Technische Anwendung von Oberflächenbeschichtungen und -filmen; Dielectrics & Electric Insulators; Dielektrika u. Isolatoren; Dielektrizität; Dünne Schichten, Oberflächen u. Grenzflächen; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Materials Science; Materialwissenschaften; Mikroelektronik; Thin Films, Surfaces & Interfaces; Dielektrika u. Isolatoren; Dünne Schichten, Oberflächen u. Grenzflächen; BB
Series Preface. Preface. (Mikhail Baklanov, Martin Green and KarenMaex). 1. Low and Ultralow Dielectric Constant Films Preparedby Plasma-Enhanced Chemical Vapor Deposition. (A.Grill). 2. Spin-On Dielectric Materials. (GeraudDubois, Willi Volksen and Robert D. Miller). 3.Porosity of Low Dielectric Constant Materials. 3.1 Positron Annihilation Spectroscopy. (David W.Gidley, Hua-Gen Peng, and Richard Vallery). 3.2Structure Characterization of Nanoporous InterlevelDielectric Thin Films with X-ray and Neutron Radiation.(Christopher L. Soles, Hae-Jeong Lee, Bryan D. Vogt, Eric K.Lin, Wen-li Wu). 3.3 Ellipsometric Porosimetry. (M. R.Baklanov). 4.Mechanical and Transport Properties of Low-kDielectrics. (J.L. Plawsky, R. Achanta, W. Cho, O.Rodriguez, R. Saxena, and W.N. Gill). 5. Integration of low-k dielectric films in damasceneprocesses. (R.J.O.M. Hoofman, V.H. Nguyen,V. Arnal, M.Broekaart, L.G. Gosset,W.F.A. Besling, M. Fayolle and F.Iacopi). 6. ONO structures and oxynitrides in modern microelectronics.Material science, characterization and application.(Yakov Roizin and Vladimir Gritsenko). High Dielectric constant Materials. 7. Material Engineering of High-k GateDielectrics. (Akira Toriumi and Koji Kita). 8. PhysicalCharacterisation of ultra-thin high-k dielectric. (T.Conard, H. Bender and W. Vandervorst). 9. Electrical Characterization of Advanced GateDielectrics. (Robin Degraeve, Jurriaan Schmitz,Luigi Pantisano, Eddy Simoen, Michel Houssa, Ben Kaezer, andGuido Groeseneken). Medium dielectric constant materials. 10. Integration Issues of High-k Gate Dielectrics.(Yasuo Nara). Dielectric films for interconnects (packaging). 11. Anisotropic Conductive Film (ACF) for AdvancedMicroelectronic Interconnects. (Yi Li, C. P.Wong). Index.Más, otros libros, que pueden ser muy parecidos a este:
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