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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneo… Más…
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ISBN: 9781441909626
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2010, ISBN: 9781441909626
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ISBN: 9781441909626
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneo… Más…
Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic:
Three Dimensional System Integration - libro nuevo12, ISBN: 9781441909626
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneo… Más…
ISBN: 9781441909626
Architecture / Design; Basics of Construction; Circuits and Systems 3D Chip Stacking, 3D Integrated Circuit Design and Manufacturing, 3D Integrated Circuits, 3D Stacked Integrated Circuit… Más…
ISBN: 9781441909626
Three Dimensional System Integration - IC Stacking Process and Design: ab 96.49 € eBooks > Sachthemen & Ratgeber > Technik Springer-Verlag GmbH, Springer-Verlag GmbH
2010, ISBN: 9781441909626
IC Stacking Process and Design, eBooks, eBook Download (PDF), 2011, [PU: Springer US], Springer US, 2010
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Detalles del libro - Three Dimensional System Integration
EAN (ISBN-13): 9781441909626
ISBN (ISBN-10): 1441909621
Año de publicación: 2010
Editorial: Springer US
246 Páginas
Idioma: eng/Englisch
Libro en la base de datos desde 2012-06-22T19:28:56-05:00 (Mexico City)
Página de detalles modificada por última vez el 2023-01-26T06:23:30-06:00 (Mexico City)
ISBN/EAN: 9781441909626
ISBN - escritura alterna:
1-4419-0962-1, 978-1-4419-0962-6
Mode alterno de escritura y términos de búsqueda relacionados:
Autor del libro: rado, papan, radojcic, papanikolaou, riko
Título del libro: system design, integration
Datos del la editorial
Autor: Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic
Título: Three Dimensional System Integration - IC Stacking Process and Design
Editorial: Springer; Springer US
246 Páginas
Año de publicación: 2010-12-07
New York; NY; US
Idioma: Inglés
53,49 € (DE)
55,00 € (AT)
59,00 CHF (CH)
Available
VIII, 246 p.
EA; E107; eBook; Nonbooks, PBS / Technik/Bautechnik, Umwelttechnik; Hochbau und Baustoffe; Verstehen; 3D Chip Stacking; 3D Integrated Circuit Design and Manufacturing; 3D Integrated Circuits; 3D Stacked Integrated Circuits; 3D System Integration; Contactless 3D Coupling; DRAM Stacking; Logic Stacking; TSV; Through-Silicon Vias; C; Building Construction and Design; Electronic Circuits and Systems; Architecture and Design; Schaltkreise und Komponenten (Bauteile); BC
Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of theinteractions between the various phases of design and manufacturing.Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems Includes supplementary material: sn.pub/extras
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