ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Más…
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ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Más…
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2009, ISBN: 9781441909848
eBooks, eBook Download (PDF), 2010, RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing … Más…
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2009, ISBN: 9781441909848
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Kindle Edition, Auflage: 2010, 492 Seiten, Publiziert: 2009-12-01T00:00:00.000Z, Produktgruppe: Digital Ebook … Más…
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2009, ISBN: 9781441909848
eBooks, eBook Download (PDF), 2010, [PU: Springer US], Springer US, 2009
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ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Más…
ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… Más…
2009
ISBN: 9781441909848
eBooks, eBook Download (PDF), 2010, RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing … Más…
2009, ISBN: 9781441909848
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Kindle Edition, Auflage: 2010, 492 Seiten, Publiziert: 2009-12-01T00:00:00.000Z, Produktgruppe: Digital Ebook … Más…
Datos bibliográficos del mejor libro coincidente
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Detalles del libro - RF and Microwave Microelectronics Packaging
EAN (ISBN-13): 9781441909848
ISBN (ISBN-10): 1441909842
Año de publicación: 2009
Editorial: Springer
285 Páginas
Idioma: eng/Englisch
Libro en la base de datos desde 2010-05-21T18:59:03-05:00 (Mexico City)
Página de detalles modificada por última vez el 2023-06-25T06:40:54-06:00 (Mexico City)
ISBN/EAN: 9781441909848
ISBN - escritura alterna:
1-4419-0984-2, 978-1-4419-0984-8
Mode alterno de escritura y términos de búsqueda relacionados:
Autor del libro: cahill, kuang
Título del libro: self packaging, microwave for one, microelectronics
Datos del la editorial
Autor: Ken Kuang; Franklin Kim; Sean S. Cahill
Título: RF and Microwave Microelectronics Packaging
Editorial: Springer; Springer US
285 Páginas
Año de publicación: 2009-12-01
New York; NY; US
Idioma: Inglés
149,79 € (DE)
154,00 € (AT)
177,00 CHF (CH)
Available
XVI, 285 p.
EA; E107; eBook; Nonbooks, PBS / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; 3D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; high-frequency electronics; material; packaging and processing methods; simulation; thermal management; thermal mechanical designs; C; Electronics and Microelectronics, Instrumentation; Microwaves, RF Engineering and Optical Communications; Electronic Circuits and Systems; Engineering; Schaltkreise und Komponenten (Bauteile); BB
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.Presents methods and techniques used for measuring and testing of the electronic materials properties Presents an in-depth discussion of ceramic materials for RF/MW packaging Presents numerical simulation methods and techniques used in analysis of electronic devices and materials Discusses thermal management issues for RF/MW packaging Presents a RF/Microwave Packaging Roadmap for Portable Devices Includes supplementary material: sn.pub/extras
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