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Dual in-line package - Frederic P. Miller
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Frederic P. Miller:

Dual in-line package - Pasta blanda

ISBN: 6130233728

[EAN: 9786130233723], Neubuch, [PU: Alphascript Publishing], This item is printed on demand - it takes 3-4 days longer - Neuware -In microelectronics, a dual in-line package, sometimes ca… Más…

NEW BOOK. Gastos de envío:Versandkostenfrei. (EUR 0.00) BuchWeltWeit Inh. Ludwig Meier e.K., Bergisch Gladbach, Germany [57449362] [Rating: 5 (von 5)]
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Dual in-line package / Frederic P. Miller (u. a.) / Taschenbuch / Englisch / Alphascript Publishing / EAN 9786130233723 - Miller, Frederic P.
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Miller, Frederic P.:

Dual in-line package / Frederic P. Miller (u. a.) / Taschenbuch / Englisch / Alphascript Publishing / EAN 9786130233723 - Pasta blanda

ISBN: 9786130233723

[ED: Taschenbuch], [PU: Alphascript Publishing], In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing an… Más…

Gastos de envío:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) Buchbär
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Dual in-line package | Frederic P. Miller (u. a.) | Taschenbuch | Englisch | Alphascript Publishing | EAN 9786130233723 - Miller, Frederic P.
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Miller, Frederic P.:
Dual in-line package | Frederic P. Miller (u. a.) | Taschenbuch | Englisch | Alphascript Publishing | EAN 9786130233723 - Pasta blanda

ISBN: 9786130233723

[ED: Taschenbuch], [PU: Alphascript Publishing], In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing an… Más…

Gastos de envío:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) preigu
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Dual in-line package
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Dual in-line package - libro nuevo

ISBN: 9786130233723

In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins… Más…

  - Nr. URPLPB0M42N. Gastos de envío:Versandkosten: 0 EUR, 11, zzgl. Versandkosten. (EUR 0.00)
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Dual in-line package
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Dual in-line package - encuadernado, tapa blanda

2009, ISBN: 9786130233723

[ED: Kartoniert / Broschiert], [PU: Alphascript Publishing], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. In microelectronics, a dual i… Más…

Gastos de envío:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) Moluna GmbH

1Dado que algunas plataformas no nos comunican las condiciones de envío y éstas pueden depender del país de entrega, del precio de compra, del peso y tamaño del artículo, de una posible membresía a la plataforma, de una entrega directa por parte de la plataforma o a través de un tercero (Marketplace), etc., es posible que los gastos de envío indicados por eurolibro/terralibro no concuerden con los de la plataforma ofertante.

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Detalles del libro
Dual in-line package

In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase 'DIP package' is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.

Detalles del libro - Dual in-line package


EAN (ISBN-13): 9786130233723
ISBN (ISBN-10): 6130233728
Tapa dura
Tapa blanda
Año de publicación: 2009
Editorial: International Book Marketing Service Ltd

Libro en la base de datos desde 2008-06-10T16:48:44-05:00 (Mexico City)
Página de detalles modificada por última vez el 2024-01-21T18:47:58-06:00 (Mexico City)
ISBN/EAN: 9786130233723

ISBN - escritura alterna:
613-0-23372-8, 978-613-0-23372-3
Mode alterno de escritura y términos de búsqueda relacionados:
Autor del libro: miller
Título del libro: package, dual, all line, microelectronics


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