Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates - Pasta blanda
2011, ISBN: 9783832527761
Logos Verlag Berlin GmbH, Paperback, 224 Seiten, Publiziert: 2011-01-28T00:00:01Z, Produktgruppe: Book, 0.46 kg, Verkaufsrang: 312609, Electronics Engineering, Electronics & Communication… Más…
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Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates - Pasta blanda
2011, ISBN: 9783832527761
Logos Verlag Berlin GmbH, Paperback, 224 Seiten, Publiziert: 2011-01-28T00:00:01Z, Produktgruppe: Book, 0.46 kg, Verkaufsrang: 312609, Electronics Engineering, Electronics & Communication… Más…
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Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates - Pasta blanda
ISBN: 9783832527761
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Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates - Pasta blanda
2011, ISBN: 3832527761
[EAN: 9783832527761], Neubuch, [PU: Logos Verlag]
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Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates - Pasta blanda
2011, ISBN: 9783832527761
Softcover, Buch, [PU: Logos Berlin]
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Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates - Pasta blanda
2011, ISBN: 9783832527761
Logos Verlag Berlin GmbH, Paperback, 224 Seiten, Publiziert: 2011-01-28T00:00:01Z, Produktgruppe: Book, 0.46 kg, Verkaufsrang: 312609, Electronics Engineering, Electronics & Communication… Más…
Rimolo-Donadio, Renato:
Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates - Pasta blanda2011, ISBN: 9783832527761
Logos Verlag Berlin GmbH, Paperback, 224 Seiten, Publiziert: 2011-01-28T00:00:01Z, Produktgruppe: Book, 0.46 kg, Verkaufsrang: 312609, Electronics Engineering, Electronics & Communication… Más…
Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates - Pasta blanda
ISBN: 9783832527761
[ED: Taschenbuch], [PU: Logos Berlin], DE, [SC: 3.00], Neuware, gewerbliches Angebot, PayPal, Banküberweisung, Internationaler Versand
Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates - Pasta blanda
2011, ISBN: 3832527761
[EAN: 9783832527761], Neubuch, [PU: Logos Verlag]
Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates - Pasta blanda
2011, ISBN: 9783832527761
Softcover, Buch, [PU: Logos Berlin]
Datos bibliográficos del mejor libro coincidente
Detalles del libro - Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates
EAN (ISBN-13): 9783832527761
ISBN (ISBN-10): 3832527761
Tapa blanda
Año de publicación: 2011
Editorial: Logos Verlag Berlin GmbH
Libro en la base de datos desde 2011-09-30T17:27:05-05:00 (Mexico City)
Página de detalles modificada por última vez el 2022-05-20T17:42:20-05:00 (Mexico City)
ISBN/EAN: 9783832527761
ISBN - escritura alterna:
3-8325-2776-1, 978-3-8325-2776-1
Mode alterno de escritura y términos de búsqueda relacionados:
Autor del libro: renato
Título del libro: validation
Datos del la editorial
Autor: Renato Rimolo-Donadio
Título: Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates
Editorial: Logos Berlin
Año de publicación: 2011-01-28
Idioma: Inglés
37,50 € (DE)
38,60 € (AT)
Not available, publisher indicates OP
BC; PB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik, Nachrichtentechnik; Elektrotechnik, Elektronik; Signalintegrität; Spannungsversorgung; Elektromagnetische Verträglichkeit; Leiterplatte; Durchkontaktierung (Via); TU Hamburg-Harburg; 2010
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